Solutions Overview

From RTL to production, delivering optimized PPA with full-flow ASIC design and manufacturing services.

Complete ASIC flow support including NRE design, simulation, verification, and layout.

Covers wafer fabrication, packaging, testing, and engineering sample delivery.

Optimized Netlist-to-GDSII layout using EDA tools to improve PPA (performance, power, and area).

Support for SoC platforms based on ARM, Andes, and RISC‑V.

Advanced packaging solutions including 3D IC, SiP, and high-bandwidth CoWoS technologies, in partnership with ASE and TSMC.

System-in-Package (SiP) and 3D packaging integration support.

Advanced 2.5D/3D CoWoS packaging integrating logic and HBM.

FCBGA, WLCSP, LGA, DRQFN advanced packaging options in collaboration with ASE.

Turnkey IP solutions covering high-speed, analog, embedded, and UCIe IPs from global ecosystem partners.

Licensing and integration with Synopsys, Cadence, M31, ARM, Andes, and eMemory.

Support for PCIe, USB, SerDes, DDR, MIPI, and more.

Offers OEM IP solutions in partnership with Synopsys.

Custom IP design including ADC, DAC, AFE, LDO, and related patents.

Support for advanced UCIe die-to-die interface technology.

Robust post-silicon validation, reliability testing, and supply chain orchestration for volume production success.

Includes CP/FT test flow, with Credence D10, Chroma 3650, and Ytec S1007D platforms.

Professional FA service with root cause diagnostics and reporting.

Full range of reliability validation for various product applications.

Multi-vendor coordination and logistics to ensure manufacturing success.