OSAT Solutions
Our Outsourced Semiconductor Assembly and Test (OSAT) services provide comprehensive backend packaging and test solutions to ensure high reliability and accelerated time-to-market.
Service Portfolio
| Service | Description |
|---|---|
| Packaging | Advanced packaging technologies including wafer-level packaging, flip-chip, and system-in-package solutions. |
| Bumping | Chip-to-package bumping services for robust electrical and mechanical connections. |
| Assembly | Component assembly and packaging into final form factors, with strict quality control. |
| Testing | Functional testing and reliability verification to ensure compliance with specifications. |
| Dropship | Direct shipment of packaged devices to end customers, optimizing logistics. |
OSAT Process Flow
Why OSAT With Us?
- End-to-end backend services with strict quality assurance.
- State-of-the-art packaging technologies tailored for your product.
- Flexible logistics solutions including dropship to end customers.
- Experienced team ensuring fast turnaround and yield optimization.